Power Electronics

We develop compact, efficient, and EMC-compliant power electronics. From AC/DC power supplies and DC/DC converters to (bidirectional) inverters and regenerative motor drives. We apply SiC and GaN technology where it delivers the greatest benefit, and Functional Safety according to IEC 61508 where required. This enables you to bring an industrial-grade, robust, and demonstrably compliant product to market faster and with greater predictability.

Why Inspiro?

• SiC & GaN Expertise: We select the most suitable semiconductor technology based on efficiency, power density, and overall system performance.
• Converter Topology Design: Development of 2-level and 3-level (NPC/T-Type) converters, resonant (LLC) converters, and Dual Active Bridge (DAB) topologies, all optimized for compact size and maximum efficiency.
• Thermal & EMC by Design: EMI reduction starts at the architecture and PCB layout level. Designs are continuously refined through iterative testing, verification, and optimization in our in-house laboratory.
• End-to-End Development: Complete development from concept through simulation, electronics, embedded software (DSP/FPGA), testing, pre-compliance, and certification.
• Model-Based & Measurement-Driven Engineering: Development using MATLAB/Simulink, PLECS, and SPICE, combined with laboratory measurements and iterative prototyping.

What We Design

Converters, Inverters & Power Supplies

• (Bidirectional) AC/DC & DC/DC Converters: PFC stages, Switched-Mode Power Supplies (SMPS), Resonant LLC converters, Dual Active Bridge (DAB) converters
• Grid-Forming Inverters: Power conversion solutions for applications such as microgrids and distributed energy systems.

Motor Drives

• DC/AC Inverters: 2-level and 3-level (NPC/T-Type) architectures using SiC and GaN technology for high efficiency, high current capability, and compact filtering solutions.
• Regenerative Drives: Energy recovery back to the DC bus or battery, including controlled braking strategies.
• FOC-Ready Control: Fast current and flux control loops, observer techniques, Space Vector Modulation (SVM) and dead-time compensation.

DSP & FPGA Development

• DSP Development (e.g., TI C2000): Control Law Accelerator (CLA), PWM generation, advanced control algorithms, real-time protection mechanisms, functional safety software development
• FPGA Development: High-speed signal processing, multi-channel measurements, lockstep architectures and CRC, deterministic safety mechanisms
• Firmware Development: Protection functions (OVP, UVP, OCP, OTP, desaturation detection), diagnostics, data logging, field firmware updates
• Voltage & Current Control: Accurate control loops with excellent transient performance and line/load regulation.

Magnetics – Design Advice & Optimization

• Core material selection, air-gap optimization, winding design (litz wire, foil, planar)
• Leakage inductance and coupling optimization for reduced current ripple and EMI; Acoustic and thermal optimization
• Lifecycle management, component availability, footprint compatibility, and cost optimization for series production

Topology Selection

We select either 2-level or multilevel (NPC/T-Type) architectures based on: Total Harmonic Distortion (THD), switching and conduction losses, dv/dt performance, system cost and overvoltage behaviour at cable and motor terminals. For bidirectional DC/DC applications, we apply either LLC or Dual Active Bridge (DAB) topologies. The result is higher power density, smaller heatsinks and filters, and lower overall system cost.

Tools & Methodology

• Simulation: MATLAB/Simulink (Model-Based Design), PLECS (loss and thermal analysis), SPICE (transient simulation)
• Validation: Hardware-in-the-Loop (HIL), Processor-in-the-Loop (PIL), and Software-in-the-Loop (SIL) where appropriate, complemented by step-response analysis and verification in our in-house laboratory.
• Engineering Deliverables: Schematics, PCB design constraints, power-loss breakdowns, derating curves, safe Operating Area (SOA) analyses
• Dedicated Power Electronics Laboratory: Complete validation and optimization in our own power electronics lab.

Thermal & EMC by Design

• Thermal Engineering: Natural and forced convection, heatsink selection, thermal interface materials, hotspot mitigation
• EMC Engineering: Return path optimization, switching node geometry, dv/dt control, snubber design, common-mode and differential-mode filtering
• Pre-Compliance Testing: Conducted and radiated emissions, ESD, EFT, and surge testing with iterative design improvements before final certification.

Functional Safety & Compliance

• IEC 61508 (SIL-Oriented): Hazard and Risk Analysis, FMEDA, diagnostic Coverage, proof test intervals, safety plan and safety manual
• IEC 61800-5-2 (Drives): Implementation of STO/SS1/SS2, SLS, SLP: including safe torque and safe speed functions.
• Additional Standards: IEC 62109 (PV Inverters), EN 61000-6-2 / EN 61000-6-4 (Industrial EMC), IEC 62368-1 (General Product Safety where applicable)
• Safety Deliverables: Safety requirements and specifications, Technical Safety Concept (TSC), Technical Safety Requirements (TSR), full requirements traceability, verification reports, compliance documentation

Applications

Renewable Energy (Solar & BESS)

• String and central inverters microinverters, MPPT converters, grid-forming inverters
• Battery Energy Storage Systems (BESS): bidirectional buck-boost DC/DC converters, high C-rate battery systems, efficiency optimization, system-level thermal runaway prevention. Battery Management System (BMS) development including SoC and SoH estimation and calibration

E-Mobility & Charging Infrastructure

• On-board and off-board power converters, PFC front-ends, regenerative drive systems, communication with charging infrastructure (OCPP where required), MID-certified energy metering integration

Building Automation & HVAC

• High-efficiency power supplies, UPS systems, fan and pump drive control, integration into existing industrial networks

Aerospace & Research

• Mission-critical power electronics and embedded control systems designed for demanding EMC and thermal environments, with advanced diagnostics and logging capabilities.

Development Process

1. Architecture & Specification – use cases, topology selection, system architecture (including processor selection), safety and EMC risk assessment, and manufacturability analysis.
2. Design – Model-based engineering using MATLAB/Simulink and PLECS, semiconductor sizing, magnetic component design, filter design, rapid prototyping, and cost optimization.
3. Electronics & Firmware Development – schematics, PCB layout, DSP and FPGA software, low-level and high-level control algorithms, protection functions, Design for Test (DFT), and Design for Manufacturing (DFM).
4. Prototype & Testing – hardware bring-up, electrical characterization, thermal and EMC testing, followed by iterative design improvements.
5. Pre-Compliance & Safety Documentation – measurement reports, FMEDA, Safety Manual, and verification matrix.
6. Industrialization – final validation, production transfer, and manufacturing optimization.

Typical Deliverables

System architecture documentation, simulation reports, schematics and PCB design packages, magnetics design recommendations, embedded firmware, test and measurement reports, functional safety documentation (FMEDA, Safety Plan, Safety Manual) and compliance dossier.

Schedule a free consultation.

Schedule a free, no-obligation consultation to discuss your project and requirements. Within 10 working days, you’ll receive a tailored proposal outlining our recommended approach, including an indicative timeline and budget, or a clear development roadmap for your project.